Ceramic Hybrids | Electronic Solutions

Ceramic hybrids

Miniature electronic assemblies that integrate passive and active components on ceramic substrates, offering high-reliability modules for demanding applications while maximizing power dissipation and integration.

Ceramic Hybrid Circuits, also known as Hybrid Microcircuits or Packaged Hybrids, are miniaturized electronic assemblies on ceramic substrates that integrate multiple passive and active components into a single, reliable module. Fully encapsulated in protective housings, they are used in industrial electronics, aerospace, automotive, medical devices, and power electronics. These technologies also help preserve circuit design knowledge, making it difficult to manipulate or replicate.

Key features

High reliability and stability
Compact, high-density integration
Superior thermal management
Customizable designs
Excellent electrical performance
Mixed technology integration
Long service life
Wide industry compatibility
Cost-effective for medium-to-high production volumes

Related services

Laser resistor trimming, terminal, coating
R&D

macro of a ceramic hybrid circuit with electronic components mounted on white and blue sections with precision gold tracks

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Process description

Thick-film or thin-film circuit printing

High-purity alumina (Al₂O₃), aluminum nitride (AlN), or other advanced ceramics are selected for their excellent thermal and electrical properties. Substrates are machined, cleaned, and prepared for thick-film or thin-film processing.
Thick-film or thin-film circuit printing

Conductive pastes (Ag/Pd, Au, Pt) are screen-printed to create circuit traces, pads, and terminations. Resistive pastes or thin-film materials are added to create integrated resistors. Multiple layers can be stacked, dried, and fired to form a robust and dense interconnect architecture.
Component integration

Passive components (resistors, capacitors, inductors) and active bare dies components (diodes, ICs, transistors) are placed on the substrate using die-attach and wire bonding. SMD components may also be mounted using solder or conductive adhesives. Die attach is the process of mechanically and thermally attaching a semiconductor die (chip) to a package substrate or leadframe, providing both physical support and a thermal/electrical path. Wire bonding is the process of forming electrical interconnections between the die bond pads and the package leads or substrate using fine metal wires normally (Ø 17 up to 250 µm) made of Gold (Au), Aluminum (Al). Bonds are formed on the die pad using heat, pressure, and/or ultrasonic energy.
Laser trimming and calibration

Precision laser trimming adjusts resistive elements to meet tight tolerance requirements. Functional calibration performed in Alutron ensures the module meets electrical operative specifications.
Encapsulation and protection

Modules may be coated with epoxy, silicone, glass, or placed into hermetic packages to ensure long-term reliability in harsh environments.
Final electrical testing

Each hybrid is tested for continuity, resistive values, insulation, thermal behaviour, and functional performance to ensure compliance with industry standards (MIL-STD, IPC, automotive specs).

Industries

Avionics

Compact and robust solutions for onboard electronic systems. Modular racks and subracks with dimensional customization and aerospace-compliant surface treatments.
Railway

Rugged solutions compliant with railway standards. Reinforced rack and subrack systems designed according to EN 50155 requirements.
Industrial automation

Durable enclosures for demanding industrial environments. Racks and subracks with shielding and ventilation options for PLCs, HMI, and distributed control systems.

Create your perfect solution

By using Alutron Rack Configurator, you will be able to create your very own
Rack, and even create the CAD file and start the order!

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Shaping the future of modular mechanics and electronics

Mechanical

Electronics

ALUTRON protect and power up the electronics that move the world

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Key features

Related services

Do you need assistance?

Process description

Thick-film or thin-film circuit printing

Thick-film or thin-film circuit printing

Component integration

Laser trimming and calibration

Encapsulation and protection

Final electrical testing

Industries

Avionics

Railway

Industrial automation

Create your perfect solution

Get in touch